Advanced Materials Division
Speciality Chemicals & Gases
Process gases, wet chemicals, slurries and dry materials specified by fabrication process step.
110 Materials
| Code | Material | Form | Application |
|---|---|---|---|
| ASG-01 | Ozone (O₃) | Gas | Wafer cleaning and oxidation |
| ASG-02 | Silane (SiH₄) | Gas | Silicon deposition |
| ASG-03 | Dichlorosilane (SiH₂Cl₂) | Gas | Silicon and silicon nitride deposition |
| ASG-04 | Ammonia (NH₃) | Gas | Silicon nitride deposition and process chemistry |
| ASG-05 | Nitrous Oxide (N₂O) | Gas | Oxide deposition and oxidation |
| ASG-06 | Tungsten Hexafluoride (WF₆) | Gas | Tungsten deposition |
| ASG-07 | Phosphine (PH₃) | Gas | Phosphorus doping |
| ASG-08 | Arsine (AsH₃) | Gas | Arsenic doping |
| ASG-09 | Diborane (B₂H₆) | Gas | Boron doping |
| ASG-10 | Boron Trifluoride (BF₃) | Gas | Boron doping |
| ASG-11 | Boron Trichloride (BCl₃) | Gas | Plasma etching |
| ASG-12 | Chlorine (Cl₂) | Gas | Plasma etching |
| ASG-13 | Hydrogen Bromide (HBr) | Gas | Silicon plasma etching |
| ASG-14 | Carbon Tetrafluoride (CF₄) | Gas | Plasma etching |
| ASG-15 | Hexafluoroethane (C₂F₆) | Gas | Plasma etching/chamber cleaning |
| ASG-16 | Octafluoropropane (C₃F₈) | Gas | Plasma etching |
| ASG-17 | Octafluorocyclobutane (C₄F₈) | Gas | Plasma etching and sidewall passivation |
| ASG-18 | Trifluoromethane (CHF₃) | Gas | Dielectric plasma etching |
| ASG-19 | Difluoromethane (CH₂F₂) | Gas | Plasma etching |
| ASG-20 | Nitrogen Trifluoride (NF₃) | Gas | CVD chamber cleaning |
| ASG-21 | Sulfur Hexafluoride (SF₆) | Gas | Silicon and SiC plasma etching |
| ASG-22 | Fluorine (F₂) | Gas | Advanced etching/chamber cleaning |
| ASG-23 | Argon (Ar) | Gas | Plasma generation and sputtering |
| ASG-24 | Helium (He) | Gas | Wafer cooling and plasma processing |
| ASG-25 | Nitrogen (N₂) | Gas | Purging and inert atmosphere |
| ASG-26 | Oxygen (O₂) | Gas | Oxidation and plasma processing |
| ASG-27 | Hydrogen (H₂) | Gas | Annealing and semiconductor processing |
| ASG-28 | Carbon Dioxide (CO₂) | Gas | Selected cleaning/process and facility applications |
| ASF-01 | Hydrofluoric Acid (HF) | Fluid | Silicon dioxide/native oxide removal, wafer cleaning and etching |
| ASF-02 | Hydrochloric Acid (HCl) | Fluid | Wafer cleaning, metal cleaning and etching |
| ASF-03 | Sulfuric Acid (H₂SO₄) | Fluid | Photoresist stripping and wafer cleaning |
| ASF-04 | Nitric Acid (HNO₃) | Fluid | Silicon, SiC and metal etching |
| ASF-05 | Phosphoric Acid (H₃PO₄) | Fluid | Silicon nitride etching |
| ASF-06 | Acetic Acid | Fluid | Wet etching and cleaning formulations |
| ASF-07 | Hydrogen Peroxide (H₂O₂) | Fluid | Wafer cleaning, oxidation, resist stripping and CMP |
| ASF-08 | Ammonium Hydroxide (NH₄OH) | Fluid | Wafer cleaning and particle removal |
| ASF-09 | Tetramethylammonium Hydroxide (TMAH) | Fluid | Photoresist development and silicon etching |
| ASF-10 | Buffered Oxide Etch (BOE) | Fluid | Controlled silicon dioxide removal |
| ASF-11 | Isopropyl Alcohol (IPA) | Fluid | Wafer cleaning, drying and package cleaning |
| ASF-12 | Acetone | Fluid | Photoresist and organic-material removal |
| ASF-13 | Methanol | Fluid | Cleaning and solvent processing |
| ASF-14 | Ethanol | Fluid | Cleaning and solvent processing |
| ASF-15 | N-Methyl-2-pyrrolidone (NMP) | Fluid | Photoresist stripping and adhesive removal |
| ASF-16 | PGMEA | Fluid | Photoresist solvent |
| ASF-17 | PGME | Fluid | Photoresist/coating solvent |
| ASF-18 | Methyl Isobutyl Ketone (MIBK) | Fluid | Photoresist processing |
| ASF-19 | Methyl Ethyl Ketone (MEK) | Fluid | Solvent cleaning and coating |
| ASF-20 | Xylene | Fluid | Photoresist/coating solvent |
| ASF-21 | n-Butyl Acetate | Fluid | Photoresist solvent |
| ASF-22 | Ethyl Lactate | Fluid | Photoresist solvent |
| ASF-23 | Hexamethyldisilazane (HMDS) | Fluid | Photoresist adhesion promoter |
| ASF-24 | Photoresist | Fluid | Lithographic pattern transfer |
| ASF-25 | Photoresist Developer | Fluid | Development of lithographic patterns |
| ASF-26 | BARC | Fluid | Anti-reflective coating during lithography |
| ASF-27 | TARC | Fluid | Lithography reflection control |
| ASF-28 | Silicon Tetrachloride (SiCl₄) | Fluid | Silicon-containing film deposition |
| ASF-29 | Trichlorosilane (SiHCl₃) | Fluid | Silicon deposition |
| ASF-30 | TEOS | Fluid | Silicon dioxide deposition |
| ASF-31 | Titanium Tetrachloride (TiCl₄) | Fluid | Titanium-containing film deposition |
| ASF-32 | Trimethylaluminum (TMA) | Fluid | ALD of aluminum oxide and related films |
| ASF-33 | TDMAT | Fluid | Titanium thin-film deposition |
| ASF-34 | TEMAH | Fluid | Hafnium oxide deposition |
| ASF-35 | Colloidal Silica | Fluid | CMP wafer polishing |
| ASF-36 | Methanesulfonic Acid (MSA) | Fluid | Tin and metal plating |
| ASF-37 | Epoxy Resin | Fluid | Die attach and encapsulation |
| ASF-38 | Silver-Filled Epoxy | Fluid | Conductive die attachment |
| ASF-39 | Conductive Adhesive | Fluid | Die/component attachment |
| ASF-40 | Underfill Epoxy | Fluid | Flip-chip reinforcement |
| ASF-41 | Solder Paste | Fluid | Package interconnection |
| ASF-42 | Flux | Fluid | Soldering and oxide removal |
| ASF-43 | Organic Acid Flux | Fluid | Soldering |
| ASF-44 | Flux Remover | Fluid | Post-solder cleaning |
| ASF-45 | Thermal Interface Material | Fluid | Heat transfer from semiconductor packages |
| ASF-46 | Silver Sintering Paste | Fluid | High-power die attachment |
| ASF-47 | Grinding Fluid | Fluid | Wafer backgrinding |
| ASF-48 | Cutting Fluid | Fluid | Wafer dicing |
| ASF-49 | Temporary Bonding Adhesive | Fluid | Wafer thinning and advanced packaging |
| ASF-50 | Sodium Hypochlorite (NaOCl) | Fluid | Water treatment |
| ASF-51 | Coagulant Polymer | Fluid | Wastewater treatment |
| ASF-52 | Flocculant Polymer | Fluid | Wastewater treatment |
| ASLSM-01 | Potassium Hydroxide (KOH) | Liquid-Solid Mixture | Silicon and SiC etching |
| ASLSM-02 | Sodium Hydroxide (NaOH) | Liquid-Solid Mixture | Cleaning, etching and wastewater treatment |
| ASLSM-03 | Ammonium Fluoride (NH₄F) | Liquid-Solid Mixture | Buffered oxide etching |
| ASLSM-04 | Cerium Oxide (CeO₂) | Liquid-Solid Mixture | CMP polishing |
| ASLSM-05 | Aluminum Oxide (Al₂O₃) | Liquid-Solid Mixture | CMP abrasive |
| ASLSM-06 | Ammonium Persulfate | Liquid-Solid Mixture | Copper etching |
| ASLSM-07 | Ferric Chloride (FeCl₃) | Liquid-Solid Mixture | Metal etching and wastewater treatment |
| ASLSM-08 | Copper Sulfate (CuSO₄) | Liquid-Solid Mixture | Copper electroplating |
| ASLSM-09 | Nickel Sulfate | Liquid-Solid Mixture | Nickel plating |
| ASLSM-10 | Nickel Chloride | Liquid-Solid Mixture | Nickel plating |
| ASLSM-11 | Gold Plating Salts | Liquid-Solid Mixture | Gold plating |
| ASLSM-12 | Palladium Salts | Liquid-Solid Mixture | Palladium plating |
| ASLSM-13 | Tin Salts | Liquid-Solid Mixture | Tin plating |
| ASLSM-14 | Silver Salts | Liquid-Solid Mixture | Silver plating |
| ASLSM-15 | Wax | Liquid-Solid Mixture | Temporary wafer/die mounting |
| ASLSM-16 | Calcium Hydroxide | Liquid-Solid Mixture | Wastewater neutralization |
| ASLSM-17 | Aluminum Sulfate | Liquid-Solid Mixture | Wastewater coagulation |
| ASLSM-18 | Sodium Bisulfite | Liquid-Solid Mixture | Dechlorination |
| ASLSM-19 | Sodium Metabisulfite | Liquid-Solid Mixture | Dechlorination |
| ASLSM-20 | Citric Acid | Liquid-Solid Mixture | Equipment cleaning and metal treatment |
| ASLSM-21 | EDTA | Liquid-Solid Mixture | Metal-ion complexing and cleaning |
| ASPSD-01 | Hafnium Tetrachloride (HfCl₄) | Particulate Solid-Dry | High-k dielectric deposition |
| ASPSD-02 | Die-Attach Film | Particulate Solid-Dry | Semiconductor die attachment |
| ASPSD-03 | Epoxy Molding Compound | Particulate Solid-Dry | Package encapsulation |
| ASPSD-04 | Silica Filler | Particulate Solid-Dry | Molding compounds and underfill |
| ASPSD-05 | Tin-Silver-Copper (SAC) Alloy | Particulate Solid-Dry | Lead-free soldering |
| ASPSD-06 | Rosin | Particulate Solid-Dry | Flux component |
| ASPSD-07 | Diamond Abrasive | Particulate Solid-Dry | Wafer grinding/polishing |
| ASPSD-08 | SiC Abrasive | Particulate Solid-Dry | Wafer grinding/polishing |
| ASPSD-09 | Activated Carbon | Particulate Solid-Dry | Wastewater purification |